Multilayer printed wiring board and multilayer metal clad laminated board

A multilayer printed wiring board, comprising:

• conductive layers;
• and
• insulating layers,
• the conductive layers and the insulating layers being alternately stacked,
• each of the insulating layers including one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer,
• at least one of the insulating layers including a polyolefin resin layer, the polyolefin resin layer containing:
• a component (A) representing a polyolefin-based elastomer and
• a component (B) representing a thermosetting resin, and
• the component (A) having a concentration from 50 wt. % to 95 wt. % in an entirety of the polyolefin resin layer,
• the component (A) is one or more selected from a group consisting of polystyrene-poly (ethylene/propylene) block-polystyrene copolymer, polystyrene-poly (ethylene-ethylene/propylene) block-polystyrene copolymer, polystyrene-poly (ethylene/butylene) block-polystyrene copolymer, polystyrene-polyisoprene block copolymer, hydrogenated polystyrene-polyisoprene-polybutadiene block copolymer, polystyrene-poly (butadiene/butylene) block-polystyrene copolymer, ethylene-glycidyl methacrylate copolymer, ethylene-glycidyl methacrylate-methyl acrylate copolymer, and ethylene-glycidyl methacrylate-vinyl acetate copolymer.