Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof

An amplifier module comprising:

• a substrate with a mounting surface, wherein a plurality of non-overlapping zones is defined at the mounting surface, including a first-die mounting zone and a second-die mounting zone;
• a first amplifier die in the first-die mounting zone, wherein the first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input RF signal to produce an amplified first RF signal at a first RF output terminal;
• a second amplifier die in the second-die mounting zone, wherein the second amplifier die includes one or more second power transistors configured to amplify, along a second signal path, a second input RF signal to produce an amplified second RF signal at a second RF output terminal, wherein the first amplifier die and the second amplifier die are coupled to the substrate so that the first and second signal paths through the first amplifier die and the second amplifier die extend in substantially different directions;
• and
• a summing node electrically coupled to the first and second RF output terminals, wherein the summing node is configured to receive and combine the amplified first and second RF signals.