Electronic device

An electronic device comprising:

• a first wiring substrate including a first principal surface and a second principal surface opposite to the first principal surface;
• a second wiring substrate including a third principal surface and a fourth principal surface opposite to the third principal surface;
• a first semiconductor device having a power transistor for switching;
• a second semiconductor device including a driving circuit for driving the first semiconductor device;
• a third semiconductor device including a voltage generation circuit for converting, into a second power supply voltage, a first power supply voltage supplied from outside;
• a fourth semiconductor device including a control circuit operating with the second power supply voltage supplied from the third semiconductor device, the control circuit controlling the second semiconductor device;
• and
• a plurality of connection members electrically connecting the first wiring substrate and the second wiring substrate,
• wherein the first wiring substrate and the second wiring substrate oppose each other,
• the first wiring substrate includes a plurality of first hole portions through which the plurality of connection members are inserted,
• the first semiconductor device is mounted on the third principal surface of the second wiring substrate,
• the second semiconductor device and the fourth semiconductor device are mounted on the first principal surface of the first wiring substrate,
• the third semiconductor device is mounted on the second principal surface of the first wiring substrate,
• out of a second area and a third area adjacent to each other via a first area in which the plurality of first hole portions are arranged on the first principal surface of the first wiring substrate, the second semiconductor device and the fourth semiconductor device are mounted on the second area, and
• out of a fourth area positioned opposite the second area and a fifth area positioned opposite the third area on the second principal surface of the first wiring substrate, the third semiconductor device is mounted on the fifth area.