Press-fit power module and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsJie Chang, Huibin Chen, Tiburcio Maldo, Keunhyuk Lee
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Abstract
Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.
Claims18
A semiconductor package comprising:
- one or more die electrically coupled to a leadframe;
- the leadframe comprised within a housing;
- a set of signal leads extending from the housing;
- a set of power leads extending from the housing opposite the set of signal leads;
- and
- a plurality of press fit pins, each of the press fit pins welded, soldered, or brazed to the set of signal leads and the set of power leads in a straight orientation;
- wherein the plurality of press fit pins are configured to couple with a circuit board.
A semiconductor package comprising:
- a power module comprising:
- a set of signal leads coupled to the power module;
- a set of power leads coupled to the power module on a side of the power module opposing the set of signal leads;
- and
- a press fit pin either one of welded, soldered, or brazed to each of the signal leads and to each of the power leads in a straight orientation;
- wherein the press fit pin is configured to couple with a circuit board.
A semiconductor package comprising:
- one or more die electrically coupled to a leadframe;
- the leadframe comprised within a housing;
- a set of signal leads extending from the housing, wherein a first set of press-fit pins is coupled to an end of the set of signal leads;
- a set of power leads extending from the housing on the opposite side of the housing from the set of signal leads, wherein a second set of press-fit pins is coupled to an end of the set of power leads;
- wherein the first set press fit pins and the second set of press fit pins are configured to couple with a circuit board.
Dependencies are inferred from the claim text.