Amplifier integrated feed array with modularized feed elements and amplifiers

A method comprising:

• fabricating a plurality of interchangeable modules for a multi-beam antenna (MBA) system wherein:
• the MBA system includes a feed array of radiating feed elements configured as a phased array, operable at a frequency having a characteristic wavelength (A), the feed array including the plurality of interchangeable modules;
• each of the plurality of interchangeable modules includes a distal mounting panel and a proximal mounting panel, and at least six feed array elements;
• each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the distal mounting panel;
• and
• the respective amplifiers are disposed between the proximal mounting panel and the distal mounting panel, coupled with an interior surface of the distal mounting panel and an exterior surface of the proximal mounting panel and thermally coupled with the proximal mounting panel;
• performing functional testing of each interchangeable module;
• and
• forming the feed array by integrating the interchangeable modules onto a back plate such that an interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with the back plate;
• wherein the feed array includes beam formers and the back plate includes a plurality of recessed portions, at least a portion of each beam former being disposed in a respective one of the plurality of recessed portions.

A spacecraft, comprising:

• multi-beam antenna (MBA) system;
• a reflector;
• and
• a feed array of radiating feed elements configured as a phased array and illuminating the reflector, operable at a frequency having a characteristic wavelength (A), the feed array including a plurality of interchangeable modules, wherein:
• each of the plurality of interchangeable modules includes a distal mounting panel and a proximal mounting panel, and at least six feed array elements;
• each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the distal mounting panel;
• the respective amplifiers are disposed between the proximal mounting panel and the distal mounting panel, mechanically coupled to an interior surface of the distal mounting panel and an exterior surface of the proximal mounting panel thermally coupled with the proximal mounting panel;
• and
• an interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with a back plate;
• wherein the feed array includes beam formers and the back plate includes a plurality of recessed portions, at least a portion of each beam former being disposed in a respective one of the plurality of recessed portions.