Packaged electronic device having integrated antenna and locking structure

A packaged electronic device having an integrated antenna comprising:

• a substrate structure comprising:
• a conductive die attach pad;
• conductive leads spaced apart from a first side of the conductive die attach pad;
• and
• an elongated conductive body having a first bonding portion disposed at a first end and second bonding portion disposed at an opposing second end, wherein:
• the elongated conductive body is interposed between the first side of the conductive die attach pad and the conductive leads;
• and
• the first bonding portion, the second bonding portion, and the conductive leads terminate along an edge of the packaged electronic device;
• an electronic device disposed adjacent the conductive die attach pad;
• and
• a package body encapsulating the electronic device, at least portions of the conductive die attach pad, at least portions of the conductive leads, and at least a portion of the elongated conductive body, wherein:
• the integrated antenna comprises the elongated conductive body.

A packaged electronic device having an integrated antenna comprising:

• a lead frame comprising:
• a conductive die attach pad;
• conductive leads spaced apart from a first side of the conductive die attach pad;
• and
• an elongated conductive body configured as a u-shaped member with an open portion of the u-shaped member disposed facing opposite to the conductive die attach pad and having a first bonding portion disposed at a first end and second bonding portion disposed at an opposing second end, wherein a first conductive lead is disposed within the open portion defined by the u-shaped member so that the elongated conductive body partially encloses the first conductive lead;
• a conductive probe feed structure electrically coupled to the first conductive lead and the conductive die attach pad;
• a conductive shorting structure electrically coupled to the elongated conductive body and the conductive die attach pad;
• a passive component electrically coupled between the conductive die attach pad and one of the elongated body portion and a second conductive lead;
• an electronic device disposed adjacent the conductive die attach pad;
• and
• a package body encapsulating the electronic device, the conductive probe feed structure, the conductive shorting structure, the passive component, at least portions of the conductive die attach pad, at least portions of the conductive leads, and at least a portion of the elongated conductive body, wherein:
• the integrated antenna comprises the conductive die attach pad, the at least one lead, the elongated conductive body, the conductive probe feed structure, and the conductive shorting structure.