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US 10,563,006 B2Granted
Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
AssigneeTaiwan Union Technology Corporation
InventorsGuan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
Life of this patent
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Abstract
A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
Claims12
A resin composition, comprising:
- (A) an epoxy resin selected from the group consisting of dicyclopentadiene-type (DCPD-type) epoxy resin, phenolic-type epoxy resin, bisphenol-type epoxy resin, diphenylethylene-type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, tri(4-hydroxyphenyl)methane-type epoxy resin, biphenyl-type epoxy resin, xylylene-type epoxy resin, biphenyl aralkyl-type epoxy resin, naphthalene-type epoxy resin, alicyclic epoxy resin, and combinations thereof;
- (B) a first hardener of formula (II):
- wherein n is an integer from 1 to 10;
- and
- a catalyst selected from the group consisting of 2,3-diaminopyridine, 2,5-diaminopyridine, 2,6-diaminopyridine, 4-dimethylaminopyridine, 2-amino-3-methylpyridine, 2-amino-4-methylpyridine, 2-amino-3-nitropyridine and combinations thereof,
- wherein, the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener is from about 1:0.4 to about 1:1.6, and
- wherein the amount of the catalyst is from about 0.1 wt % to about 1 wt % based on the dry weight of the resin composition.
4 more elements
Dependencies are inferred from the claim text.