Power semiconductor module and power semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorKenshi Terashima
Life of this patent
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Abstract
The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.
Claims18
A power semiconductor module comprising:
- a housing which houses a power semiconductor chip;
- a plurality of control pins which protrude outward from an upper surface of the housing, and establish a direct electrical connection between the power semiconductor chip and a control board, at least one of the plurality of control pins being electrically connected to a driver IC to transfer a supply voltage to the driver IC or a control signal to control operation of the power semiconductor chip;
- and
- at least one guide pin which protrudes outward from the upper surface of the housing, wherein
- each of the plurality of control pins has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing, the at least one step contacting a back surface of the control board, and
- a maximum diameter of each of the plurality of control pins is smaller than a maximum diameter of the at least one guide pin.
Dependencies are inferred from the claim text.