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US 10,561,011 B1Granted
Combined heat sink and photon harvestor
AssigneeLoon LLC
InventorKevin Anderson
Life of this patent
Estimating the term…
Abstract
A heat transfer system includes a first component formed of a thermally conductive material and a second component including a surface adapted to capture stray photons to provide heat to the electronic device. The first component is secured and thermally coupled with an electronic device. In particular, the first component includes first and second layers. The first component is in superposed relation with the second component.
Claims21
A heat transfer system comprising:
- a first component formed of a thermally conductive material, the first component secured and thermally coupled with an electronic device, the first component including first and second layers;
- and
- a second component including a surface adapted to capture stray photons to provide heat to the electronic device, wherein the first component is in superposed relation with the second component.
A passive heat transfer system comprising:
- a first layer monolithically formed of a thermally conductive material having thermal conductivity greater than about 200 W/(m*K), the first layer secured and thermally coupled with an electronic device;
- and
- a second layer including a surface adapted to capture stray photons to provide heat to the electronic device, wherein the first layer is in superposed relation with the second layer.
Dependencies are inferred from the claim text.