Adhesive composition for photocurable interface and surface modification method of substrate using the same

An adhesive composition for photocurable interface comprising:

• an organic functional silane compound represented by Chemical Formula 1 below,
• a silane compound represented by Chemical Formula 2 below, and methoxypropanol:
• in Chemical Formula 1,
• R1 is C3-C20 alkyl substituted with an organic functional group selected from the group consisting of mercapto, epoxy, methacryloxy, acryloxy, chloro, cyano, ketone, aldehyde, carboxylate, amine, C1-C10 alkylamine, amide, isocyanurate, glycidyloxy and C1-C10 alkylamino, and
• R2, R3 and R4 are the same as each other or different from each other, and each independently selected from the group consisting of C1-C10 alkyl, C1-C10 alkyl substituted with C1-C10 alkoxy, and C6-C20 aryl, and
• in Chemical Formula 2,
• R5, R6, R7, R8, R9 and R10 are each independently selected from the group consisting of C1-C10 alkyl, C1-C10 alkyl substituted with C1-C10 alkoxy, and C6-C20 aryl, and
• A is selected from the group consisting of C1-C10 alkylene, and C6-C20 arylene;
• and
• wherein the organic functional silane compound represented by Chemical Formula 1 has 0.01 to 2 wt % of the total composition, and the silane compound represented by Chemical Formula 2 has 0.001 to 0.5 wt % of the total composition.