Soft hand copolyamide composition
OwnerQuentin Pineau, Bruno D'Herbecourtinventors
Life of this patent
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Abstract
Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (Tm) from about 90 to about 150° C., in particular from about 100° C. to about 125° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.
Claims8
A method of using a heat-sensitive adhesive in the textile industry, comprising the steps of:
- a) forming a heat-sensitive adhesive composition of a HMA (hot-melt adhesive), consisting of on a weight basis, the total being equal to 100%:
- from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (Tm) from about 100° C. to about 125° C., and having a flexural modulus less than 100 MPa, as determined according to standard ISO 178 (2010);
- the said amide unit being 6/12, with a weight proportion of the long chain aliphatic repeat unit C12 of the amide unit being from 70% to 80%, the polyether units being derived from polytetramethtylene glycol (PTMG), the weight proportion of polyether units in the copolyamide being greater than 50%,
- from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof wherein said heat-sensitive adhesive is selected from the group consisting a veil, a film, in granules, a filament, and a grate;
- b) melting said heat-sensitive composition by heating;
- c) applying said adhesive to two parts of a textile;
- d) allowing said heat-sensitive adhesive composition to cool.
Dependencies are inferred from the claim text.