Back to results
US 10,542,646 B2Granted
Surface mount metal unit and electric device including same
AssigneeSamsung Electronics Co., Ltd.
InventorsChang-Joon Lee, Yong-Won Lee, Hyun-Tae Jang
Life of this patent
Estimating the term…
Abstract
According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.
Claims20
A surface mount metal unit comprising:
- a core metal layer comprising iron (Fe);
- and
- an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board,
- wherein the outer layer comprises an alloy including copper (Cu)-nickel (Ni)-zinc (Zn).
1 more element
A printed circuit board assembly structure comprising:
- a printed circuit board;
- and
- a mechanical component bonded to the printed circuit board and formed of a metal unit including a plurality of metal layers,
- wherein the mechanical component is solder bonded to the printed circuit board,
- wherein the metal unit comprises:
- a core metal layer comprising iron (Fe), and
- an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to the printed circuit board, and
- wherein the outer layer comprises an alloy including copper (Cu)-nickel (Ni)-zinc (Zn).
5 more elements
An electronic device comprising:
- a housing;
- a display exposed through a first face of the housing;
- a printed circuit board positioned within the housing;
- and
- a mechanical component bonded to the printed circuit board and formed of a metal unit including a plurality of metal layers,
- wherein the mechanical component is solder bonded to the printed circuit board,
- wherein the metal unit includes:
- a core metal layer comprising iron (Fe), and
- an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to the printed circuit board, and
- wherein the outer layer comprises an alloy including copper (Cu)-nickel (Ni)-zinc (Zn).
7 more elements
Dependencies are inferred from the claim text.