Method for manufacturing a flexible printed circuit board
AssigneesHongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
InventorsXian-Qin Hu, Cheng-Jia Li
Life of this patent
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Abstract
A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.
Claims18
A method for making a flexible printed circuit board comprising:
- providing a flexible substrate, the flexible substrate comprising a base layer and a first copper foil layer and a second copper foil layer both formed on opposite surfaces of the base layer;
- defining at least one connecting hole in the flexible substrate, each connecting hole penetrating the first copper foil layer and the base layer;
- forming a conductive pattern layer on the flexible substrate through plating with copper, the conductive pattern layer comprising a conductive pole filled in the connecting hole and a pattern line formed on a surface of the first copper foil layer away from the base layer and a surface of the second copper foil layer away from the base layer, one end of each conductive pole being positioned on a surface of the second copper foil layer facing the base layer, and the conductive poles electrically connecting the first copper foil layer and a second copper foil layer, a diameter of the conductive pole being smaller than a diameter of the connecting hole;
- and
- performing an etching treatment on the flexible substrate to remove regions where the first copper foil layer and a second copper foil layer are not covered with the conductive pattern layer to respectively form the first copper foil layer and the second copper foil layer into a first conductive pattern layer and a second conductive pattern layer.
A method for making a conductive pattern layer comprising:
- providing a flexible substrate, the flexible substrate comprising a base layer, a first copper foil layer and a second copper foil layer, the first and the second copper foil layers being formed on opposite surfaces of the base layer;
- defining at least one connecting hole in the flexible substrate, each of the connecting hole penetrating the first copper foil layer and the base layer;
- forming a conductive pattern layer on the flexible substrate by plating with copper, the conductive pattern layer comprising a conductive pole filled in the connecting hole and a pattern line formed on a surface of the first copper foil layer away from the base layer and a surface of the second copper foil layer away from the base layer, one end of the conductive pole being positioned on a surface of the second copper foil layer facing the base layer, and the conductive pole electrically connecting the first copper foil layer and a second copper foil layer, a diameter of the conductive pole being smaller than a diameter of the connecting hole;
- and
- performing an etching treatment on the flexible substrate to remove regions where the first copper foil layer and a second copper foil layer are not covered with the conductive pattern layer so as to respectively form the first copper foil layer and the second copper foil layer into a first conductive pattern layer and a second conductive pattern layer.
Dependencies are inferred from the claim text.