3D printed sensor and cushioning material
AssigneeIntel Corporation
InventorsTodd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer
Life of this patent
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Abstract
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.
Claims21
A method of building a sensor with a 3D printer, the method comprising:
- building a first conductive substrate;
- building a second conductive substrate;
- and
- building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including:
- a first latticed structure including a first plurality of legs extending inwardly at a first angle, the first latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction, the second stiffness different than the first stiffness;
- and
- a second latticed structure including a second plurality of legs extending inwardly at a second angle, the second angle different than the first angle, the second latticed structure having a third stiffness in a third direction and a fourth stiffness in a fourth direction different than the third direction, the fourth stiffness different than the third stiffness.
A non-transitory machine readable medium comprising executable instructions that, when executed, cause a 3D printer to at least:
- build a first conductive substrate;
- build a second conductive substrate;
- and
- build a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including:
- a first latticed structure including a first plurality of legs extending inwardly at a first angle, the first latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction, the second stiffness different than the first stiffness;
- and
- a second latticed structure including a second plurality of legs extending inwardly at a second angle, the second angle different than the first angle, the first and second latticed structure having a third stiffness in a third direction and a fourth stiffness in a fourth direction different than the third direction, the fourth stiffness different than the third stiffness.
Dependencies are inferred from the claim text.