Printed circuit board with routing of a conductor and dielectric strands
AssigneeInternational Business Machines Corporation
InventorsYanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik
Life of this patent
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Abstract
Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.
Claims7
A printed circuit board, comprising:
- a first dielectric material in communication with a first ground conductive layer;
- a second dielectric material in communication with a second ground conductive layer;
- and
- an intermediate layer positioned between and separated from the first dielectric material and the second dielectric material, the separation to form an opening between the first dielectric material and the second dielectric material, the intermediate layer comprising:
- a conductor configured to carry a first signal trace;
- a first fiberglass material positioned between the first conductor and the first dielectric material;
- and
- a second fiberglass material positioned between the first conductor and the second dielectric material.
Dependencies are inferred from the claim text.