Imaging element, endoscope, and endoscope system

An imaging element, comprising:

• a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals according to quantity of received light, the vertical selecting unit being configured to sequentially select the pixel unit in row units and read out the imaging signals;
• a transmission chip where at least a power source unit and a transmission unit configured to transmit the imaging signals to a transmission cable are arranged;
• plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit;
• and
• plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip, wherein
• the transmission chip is layered and connected, along a direction orthogonal to a light receiving surface of the pixel unit, at a back surface side of the pixel chip relative to a light entering surface of the pixel chip, by the connecting portions,
• the capacitative chips are layered and connected, along the direction orthogonal to the light receiving surface of the pixel unit, at a back surface side of the transmission chip relative to a surface of the transmission chip, the surface being where the pixel chip has been layered, and
• the connecting portions are arranged so as to overlap one another as viewed in the direction orthogonal to the light receiving surface of the pixel unit.