MEMS structure and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi Heng Tsai, Chia-Hua Chu, Kuei-Sung Chang
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Abstract
A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.
Claims20
A microelectromechanical system (MEMS) device comprising:
- a substrate;
- a movable element at least partially suspended above the substrate and having at least one degree of freedom;
- and
- a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, the protrusion comprising:
- a dielectric material;
- and
- a conductive film extending over an upper surface and sidewalls of the dielectric material, wherein the conductive film is made of a material whose surface has a water contact angle of higher than about 15° measured in air.
A method of forming a MEMS device, the method comprising:
- forming in a substrate a cavity;
- forming from extending a floor of the cavity a protrusion, the protrusion being electrically coupled to a plurality of interconnect layers, the protrusion comprising:
- a dielectric material;
- and
- a conductive film extending over an upper surface and sidewalls of the dielectric material, the conductive film comprising a material whose surface has a water contact angle of higher than about 15° measured in air;
- and
- suspending above the cavity a movable element, the movable element having at least one degree of freedom and configured to contact the protrusion when moved in the one degree of freedom direction.
A microelectromechanical system (MEMS) device comprising:
- a first substrate;
- a plurality of dielectric layers atop the first substrate, a topmost of the plurality of dielectric layers comprising a bonding layer having a top surface and having a cavity formed therein;
- a plurality of interconnect layers embedded in respective ones of the plurality of dielectric layers;
- a second substrate bonded to the bonding layer;
- a movable element formed at least in part in the second substrate and having at least one degree of freedom defining a motion path;
- a protrusion extending from a floor of the cavity and located in the motion path of the movable element, the protrusion comprising:
- a dielectric material;
- and
- a conductive film extending over an upper surface and sidewalls of the dielectric materiaL, wherein the conductive film is made of a material whose surface has a water contact angle of higher than about 15° measured in air;
- and
- an electrical path between the protrusion and at least one of the interconnect layers.
Dependencies are inferred from the claim text.