Microwave antenna coupling apparatus, microwave antenna apparatus and microwave antenna package

Microwave antenna coupling apparatus comprising:

• a mold layer of mold material;
• a semiconductor element comprising a semiconductor unit and a semi-conductor feed line arranged on a first surface of the semiconductor unit, wherein the semiconductor element is arranged within the mold layer such that an outer surface of the semiconductor feed line is not covered by mold material;
• an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material;
• a redistribution layer comprising at least one redistribution substrate layer and a conductive layer, wherein the redistribution layer is arranged on a first surface of the mold layer and configured such that the conductive layer connects the outer surface of the semiconductor feed line with the outer surface of the coupling feed line;
• and
• another redistribution layer comprising a ground layer, at least one redistribution substrate layer, and a conductive layer, wherein the another redistribution layer is arranged on a second surface of the mold layer opposite the first surface and configured for signal coupling between the conductive layer and the internal coupling component, the ground layer comprising a first aperture slot for signal coupling with the antenna coupling element and a second aperture slot connected with the first aperture slot for signal coupling with the conductive layer.