Deposition mask, method of manufacturing deposition mask and metal plate
AssigneeDai Nippon Printing Co., Ltd.
InventorsChikao Ikenaga, Yo Shimazaki, Kentarou Seki, Hiroki Furushou, Chiaki Hatsuta
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Abstract
A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.
Claims18
A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
- a mask body;
- and
- a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate,
- wherein the mask body satisfies
- y≥950 and y≥23x−1280
- when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa),
- wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa, and
- wherein the mask body has a first plated metal layer and a second plated metal layer provided on the first plated metal layer.
A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
- a mask body;
- and
- a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate,
- wherein the mask body satisfies
- z≥3.7 and z≥0.1x−6.0
- when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa),
- wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa, and
- wherein the mask body has a first plated metal layer and a second plated metal layer provided on the first plated metal layer.
A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
- a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process;
- and
- a step of separating the mask body from the base material,
- wherein the mask body satisfies
- y≥950 and y≥23x−1280
- when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa),
- wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa,
- wherein the mask body has a first plated metal layer and a second plated metal layer provided on the first metal layer, and
- wherein the step of forming the mask body includes:
- a first film formation step of forming the first metal layer provided with a first opening forming the through-hole;
- and a second film formation step of forming the second metal layer provided with a second opening communication with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.
A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
- a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process;
- and
- a step of separating the mask body from the base material,
- wherein the mask body satisfies
- z≥3.7 and z≥0.1x−6.0
- when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa),
- wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa,
- wherein the mask body has a first plated metal layer and a second plated metal layer provided on the first metal layer, and
- wherein the step of forming the mask body includes:
- a first film formation step of forming the first metal layer provided with a first opening forming the through-hole;
- and a second film formation step of forming the second metal layer provided with a second opening communicating with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.
Dependencies are inferred from the claim text.