Light-emitting device and manufacturing method thereof
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsYohei Momma, Tomohiko Suganoya, Saki Obana
Life of this patent
Estimating the term…
Abstract
A light-emitting device having a curved light-emitting surface is provided. Further, a highly-reliable light-emitting device is provided. A substrate with plasticity is used. A light-emitting element is formed over the substrate in a flat state. The substrate provided with the light-emitting element is curved and put on a surface of a support having a curved surface. Then, a protective layer for protecting the light-emitting element is formed in the same state. Thus, a light-emitting device having a curved light-emitting surface, such as a lighting device or a display device can be manufactured.
Claims11
An electronic device, comprising:
- a sealant having a first curved surface and a second curved surface opposite to the first curved surface, wherein the sealant comprises a curable material;
- a light emitting element conformably disposed adjacent to the first curved surface of the sealant;
- and
- a protective layer,
- wherein the sealant is located between the protective layer and the light emitting element,
- wherein the protective layer is a stack of a glass layer, a bonding layer, and a resin layer, and
- wherein the thickness of the glass layer is greater than or equal to 20 μm and less than or equal to 200 μm.
An electronic device, comprising:
- a sealant having a first curved surface and a second curved surface opposite to the first curved surface, wherein the sealant comprises a thermosetting organic resin;
- a light emitting element conformably disposed adjacent to the first curved surface of the sealant;
- and
- a protective layer,
- wherein the sealant is located between the protective layer and the light emitting element,
- wherein the protective layer is a stack of a glass layer, a bonding layer, and a resin layer, and
- wherein the thickness of the glass layer is greater than or equal to 20 μm and less than or equal to 200 μm.
Dependencies are inferred from the claim text.