Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
AssigneeMicron Technology, Inc.
InventorSameer S. Vadhavkar
Life of this patent
Estimating the term…
Abstract
Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.
Claims20
A solid-state radiation transducer (SSRT) device, comprising:
- a radiation transducer including—
- a first semiconductor material,
- a contact electrically connected to the first semiconductor material,
- a second semiconductor material spaced apart from the first semiconductor material, and
- an active region between the first semiconductor material and the second semiconductor material;
- a transmissive support assembly attached to the radiation transducer, the transmissive support assembly including—
- a transmissive support member having a back side facing toward the radiation transducer, and
- a lead at the back side of the transmissive support member;
- and
- optically transparent solder between the contact and the lead, wherein the radiation transducer is flip-chip mounted to the transmissive support assembly via the solder.
A light-emitting device, comprising:
- a light-emitting diode including—
- a first semiconductor material,
- a contact electrically connected to the first semiconductor material,
- a second semiconductor material spaced apart from the first semiconductor material, and
- an active region between the first semiconductor material and the second semiconductor material;
- a transmissive support assembly attached to the light-emitting diode, the transmissive support assembly including—
- a transmissive support member having a back side facing toward the light-emitting diode, and
- a lead at the back side of the transmissive support member;
- and
- optically transparent solder between the contact and the lead, wherein the light-emitting diode is flip-chip mounted to the transmissive support assembly via the solder.
Dependencies are inferred from the claim text.