Semiconductor device and method of making thereof
AssigneeGeneral Electric Company
InventorsPeter Almern Losee, Alexander Viktorovich Bolotnikov, Yang Sui
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AssigneeGeneral Electric Company
InventorsPeter Almern Losee, Alexander Viktorovich Bolotnikov, Yang Sui
Estimating the term…
Embodiments of a semiconductor device and methods of forming thereof are provided herein. In some embodiments, a power semiconductor device may include a first layer having a first conductivity type; a second layer disposed atop the first layer, the second layer having the first conductivity type; a termination region formed in the second layer, the termination region having a second conductivity type opposite the first type; and an active region at least partially formed in the second layer, wherein the active region is disposed adjacent to the termination region proximate a first side of the termination region and wherein the second layer is at least partially disposed adjacent to the termination region proximate a second side of the termination region opposite the first side.
A silicon carbide (SiC) field effect transistor (FET) comprising:
A field effect transistor (FET) semiconductor device, comprising:
A silicon carbide (SiC) field effect transistor (FET) device comprising:
Dependencies are inferred from the claim text.