Package-on-package structure and package-on-package method
AssigneeChina Wafer Level CSP Co., Ltd.
InventorZhiqi Wang
Life of this patent
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Abstract
A package-on-package structure of an image sensing chip is provided, which includes: an image sensing chip package, a control chip package and a circuit board. The image sensing chip package and the control chip package are arranged on the same surface of the control chip package in parallel. The image sensing chip package includes a first substrate and an image sensing chip. The control chip package includes a second substrate and a control chip. A second surface of the first substrate is electrically connected to a first region of a first surface of the second substrate, and the circuit board is electrically connected to a second region of the first surface of the second substrate. A package-on-package method for a package-on-package structure is further provided.
Claims20
A package-on-package structure, comprising:
- an image sensing chip package comprising a first substrate and at least one image sensing chip, wherein the first substrate comprises a first surface and a second surface opposite to each other, and the image sensing chip is electrically connected to the first surface of the first substrate;
- a control chip package comprising a second substrate and at least one control chip, wherein the second substrate comprises a first surface and a second surface opposite to each other, the first surface of the second substrate comprises a first region and a second region, and the control chip is located on the second surface of the second substrate and is electrically connected to the second surface of the second substrate;
- and
- a circuit board, wherein
- the image sensing chip package and the circuit board are located on the first surface of the second substrate, the circuit board is located at a lateral side of the image sensing chip package, the second surface of the first substrate is electrically connected to the first region of the first surface of the second substrate, and the circuit board is electrically connected to the second region of the first surface of the second substrate.
A package-on-package method, comprising:
- providing an image sensing chip package, a control chip package and a circuit board, wherein the image sensing chip package comprises a first substrate and at least one image sensing chip, the first substrate comprises a first surface and a second surface opposite to each other, and the image sensing chip is electrically connected to the first surface of the first substrate, the control chip package comprises a second substrate and at least one control chip, the second substrate comprises a first surface and a second surface opposite to each other, the first surface of the second substrate comprises a first region and a second region, and the control chip is located on the second surface of the second substrate and is electrically connected to the second surface of the second substrate;
- and
- arranging the image sensing chip package and the circuit board on the first surface of the second substrate in parallel, electrically connecting the first region to the second surface of the first substrate, and electrically connecting the second region to the circuit board.
Dependencies are inferred from the claim text.