Optical semiconductor module and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorHideto Furuyama
Life of this patent
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Abstract
According to one embodiment, an optical semiconductor module is disclosed. The module includes an optical semiconductor. An electrode lead is arranged apart from the optical semiconductor element. A resin holds the optical semiconductor element and the electrode lead. An interconnect layer electrically or functionally connects the optical semiconductor element and the electrode lead. The optical semiconductor element and the electrode lead are embedded in the same surface side of the resin. A part of the interconnect layer is directly provided on the resin or provided on the resin via an insulating layer.
Claims18
An optical semiconductor module comprising:
- an optical semiconductor element;
- an electrode lead placed on substantially the same plane as the optical semiconductor element, and the electrode lead arranged apart from the optical semiconductor element;
- a resin holding the optical semiconductor element and the electrode lead;
- and
- an interconnect layer for electrically or functionally connecting the optical semiconductor element and the electrode lead,
- wherein the optical semiconductor element and the electrode lead are embedded in the same surface side of the resin, and a part of the interconnect layer is directly provided on the resin or provided on the resin via an insulating layer.
An optical semiconductor module manufacturing method comprising:
- arranging a lead frame on an adhesive member, the lead frame comprising at least one conductive lead;
- arranging at least one optical semiconductor element on the adhesive member by using the lead frame as a coordinate reference such that the at least one optical semiconductor element is not in contact with the lead frame;
- integrating the lead frame and the at least one optical semiconductor element with a resin;
- removing the adhesive member from the lead frame, the at least one optical semiconductor element and the resin;
- and
- forming at least one interconnect layer on a region exposed by removing the adhesive member such that the at least one interconnect layer electrically or functionally connects the at least one optical semiconductor element and the at least one conductive lead,
- wherein:
- the at least one conductive lead includes N (=integer 2 or more) numbers of conductive leads,
- the at least one optical semiconductor element includes the N numbers of optical semiconductor elements,
- the at least one interconnect layer includes the N numbers of interconnect layers, and
- the N numbers of the conductive leads electrically or functionally connect the N numbers of the optical semiconductor elements and the N numbers of the conductive leads, respectively.
Dependencies are inferred from the claim text.