Apparatuses and methods for semiconductor die heat dissipation
AssigneeMicron Technology, Inc.
InventorsSameer S. Vadhavkar, Xiao Li, Anilkumar Chandolu
Life of this patent
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Abstract
Apparatuses and methods for semiconductor die heat dissipation are described. For example, an apparatus for semiconductor die heat dissipation may include a substrate and a heat spreader. The substrate may include a thermal interface layer disposed on a surface of the substrate, such as disposed between the substrate and the heat spreader. The heat spreader may include a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer.
Claims24
An apparatus, comprising:
- a substrate;
- a thermal interface layer disposed on a surface of the substrate;
- and
- a heat spreader including a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer, and
- wherein the heat spreader including the plurality of substrate-facing protrusions covers an entire surface of a top die of a stack of semiconductor die.
An apparatus, comprising:
- a substrate,
- a semiconductor die on the substrate;
- a plurality of thermal dissipation pads on a surface of the substrate and the semiconductor die;
- a thermal interface layer disposed on the surface of the substrate that includes the plurality of thermal dissipation pads;
- and
- a heat spreader including a plurality of internally-facing protrusions associated with one stack of the semiconductor die, wherein a distal end of the plurality of internal-facing protrusions are at least partially disposed within the thermal interface layer,
- wherein the distal end of an internally-facing protrusion of the plurality of internally-facing protrusions is in contact with a thermal dissipation pad on the semiconductor die of the plurality of thermal dissipation pads, and
- wherein the plurality of internally-facing protrusions associated with the one stack of the semiconductor die are part of, and are formed of, a same material as the heat spreader.
An apparatus, comprising:
- a heat spreader including a plurality of protrusions formed on a bottom side of the heat spreader;
- a stack of semiconductor die including a top die;
- a thermal interface layer disposed between a surface of the top die and the bottom side of the heat spreader;
- and
- a plurality of thermal dissipation pads on the surface of the top die,
- wherein the heat spreader is disposed on the top die with the thermal interface layer between the bottom side of the heat spreader and the surface of the top die,
- wherein the plurality of protrusions imbedded, at least partially, into the thermal interface layer are in contact with at least one of the plurality of thermal dissipation pads, and
- wherein a bottom die of the stack of semiconductor die extends beyond one or more of other die in the stack of semiconductor die and a top surface of each exposed portion of the bottom die includes a plurality of thermal dissipation pads separated by corresponding portions of a thermal interface layer.
Dependencies are inferred from the claim text.