Conductive composition and electronic parts using the same
AssigneeNamics Corporation
InventorsKoji Sasaki, Noritsuka Mizumura
Life of this patent
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Abstract
A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.
Claims24
A conductive composition which comprises (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, obtained by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C., wherein the thermoplastic resin particles (C) have a number average particle diameter of primary particles of 1 μm to 50 μm, and the composition further comprises (D) metal particles having a number average particle diameter of primary particles of 0.5 μm to 20 μm.
A conductive composition which comprises (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, obtained by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C., wherein the thermoplastic resin particles (C) have a number average particle diameter of primary particles of 1 μm to 50 μm, and the solvent (B) is selected from the group consisting of diethylene glycol monobutyl ether acetate, 2-ethyl-1,3-hexane diol and 2,2,4-trimethyl-1,3-pentane diol 2-methylpropanoate.
A conductive composition which comprises (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, obtained by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C., wherein the thermoplastic resin particles (C) have a number average particle diameter of primary particles of 1 μm to 50 μm, and the solvent (B) is a solvent having a hydroxyl group and having a boiling point of 180 to 265° C.
Dependencies are inferred from the claim text.