Semiconductor module, base plate of semiconductor module, and method of manufacturing semiconductor device

A semiconductor module, comprising:

• a plurality of stacked substrates each having a semiconductor chip mounted thereon;
• a cooling fin;
• a base plate having a front surface and a rear surface, and a plurality of concave curved portions each include, at a front surface side, a bonding area to which a corresponding one of the stacked substrates is bonded, the base plate contacting, at a rear surface side, the cooling fin at a vertex of each of the concaved curved portions so that the base plate contacts the cooling fin under each bonding area to which the corresponding one of the stacked substrates is bonded, the base plate having a plurality of through holes, each of which is located outside of the bonding area;
• a plurality of screws, each of which is inserted to a corresponding one of the plurality of through holes of the base plate so that the base plate is fixed to the cooling fin;
• and
• a plurality of spacers, each of which is disposed at a position adjacent to a corresponding one of the through holes.