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US 10,541,217 B2Granted
Semiconductor package
OwnerChengwei Wuinventor
Life of this patent
Estimating the term…
Abstract
A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.
Claims18
An electronic device, comprising:
- a redistribution structure, the redistribution structure having a front surface and a back surface;
- a plurality of metal pillars;
- a processor die, the processor die having an active side and a back side, the active side of the the processor die being connected to the front surface of the redistribution structure through the plurality of metal pillars;
- a molding material;
- a set of conductive posts, the set of conductive posts being placed beside the processor die, the molding material surrounding the set of conductive posts, the set of conductive posts being connected to the front surface of the redistribution structure;
- and
- an adhesive layer, wherein the adhesive layer is located on the back side of the processor die, the processor die comprises a passivation layer on the active side, the electronic device comprises an insulating layer on the passivation layer of the processor die, a recess is formed between the redistribution structure and the processor die, there is a horizontal shift between a die edge of the processor die and an outer edge of the insulating layer, and the molding material fills the recess;
- wherein the electronic device further comprises a capacitor, a first set of solder bumps, and a second set of solder bumps, the capacitor being connected to the back surface of the redistribution structure, the capacitor being within a vertical projection of the processor die, the first set of solder bumps being connected to the set of conductive posts, the second set of solder bumps being connected to the back surface of the redistribution structure, at least one of the conductive post having a first end, a second end, and a waist, the first end having a first width, the second end having a second width, the waist having a waist width, the waist width being smaller than the first width, the waist width being smaller than the second width.
5 more elements
An electronic device, comprising:
- a redistribution structure, the redistribution structure having a front surface and a back surface;
- a plurality of metal pillars;
- a processor die, the processor die having an active side and a back side, the active side of the the processor die being connected to the front surface of the redistribution structure through the plurality of metal pillars;
- an adhesive layer, the adhesive layer being located on the back side of the processor die;
- a molding material;
- a set of conductive posts, the set of conductive posts being placed beside the processor die, the molding material surrounding the conductive posts;
- a first set of solder bumps, the first set of solder bumps being connected to the set of conductive posts;
- a DRAM module, the DRAM module being connected to the first set of solder bumps;
- a second set of solder bumps;
- a printed circuit board, the printed circuit board being connected to the back surface of the redistribution structure through the second set of solder bumps;
- a third set of solder bumps;
- and
- a flash memory, the flash memory being connected to the printed circuit board through the third set of solder bumps.
10 more elements
An electronic device, comprising:
- a redistribution structure, the redistribution structure having a front surface and a back surface, the redistribution structure comprising a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, a third insulating layer, and a third metal layer, the first metal layer being located under the first insulating layer, the second insulating layer being located under the first metal layer, the second metal layer having a plurality of holes, at least a subset of the holes forming an array;
- a processor die, the processor die having an active side and a back side, the active side of the processor being connected to the front surface of the redistribution structure;
- a conductive unit, the conductive unit being located on the back surface of the redistribution structure, the conductive unit comprising a flange, a slanting side wall, and a bottom side, the first insulating layer being located under the flange, the first metal layer being in contact with the bottom side, the second metal layer being located under the second insulating layer, the third insulating layer being located under the second metal layer, the third metal layer being located under the third insulating layer;
- a first via located in the second insulating layer;
- a second via located in the second insulating layer;
- a third via located in the third insulating layer, the third via being closer to a central point of the conductive unit than the first via from a top view;
- a fourth via located in the third insulating layer, the fourth via being closer to the central point of the conductive unit than the second via from a top view;
- a molding material;
- a fourth insulating layer, the fourth insulating layer being located on the molding material, the fourth insulating layer has an opening, the opening having an opening width;
- a first set of solder bumps;
- a conductive post, the conductive post having a first end and a second end, the first end having a first end width, the second end having a second end width, the conductive post being connected to the front surface of the redistribution structure at the first end, the conductive post being connected to one of the first set of solder bumps at the second end through the opening, the opening width being smaller than than the second end width;
- a second set of solder bumps;
- a printed circuit board, wherein the redistribution structure is connected to the printed circuit board through the second set of solder bumps;
- a third set of solder bumps;
- and
- a flash memory, the flash memory being connected to the printed circuit board through the third set of solder bumps.
13 more elements
Dependencies are inferred from the claim text.