Electronic device having electromagnetic interference shielding layer and method of manufacturing the same
AssigneeNtrium Inc.
InventorsSe Young Jung, Jung Woo Hwang, Yoon Hyun Kim, Ki Su Joo, Kyu Jae Lee
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Abstract
Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
Claims15
An electronic device comprising:
- an electronic component;
- and
- an electromagnetic interference shielding layer disposed on at least a portion of the electronic component,
- wherein the electromagnetic interference shielding layer comprises:
- magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle;
- and
- a conductive portion where conductive metal particles for electromagnetic interference shielding are sintered and formed on the conductive film of the magnetic particles.
A method of manufacturing an electronic device, the method comprising:
- providing an electronic component;
- and
- forming an electromagnetic interference shielding layer on at least a portion of the electronic component,
- wherein the electromagnetic interference shielding layer comprises:
- magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle;
- and
- a conductive portion where conductive metal particles for electromagnetic interference shielding are sintered and formed on the conductive film of the magnetic particles.
An electronic device comprising:
- an electronic component;
- and
- an electromagnetic interference shielding layer where conductive metal particles for electromagnetic interference shielding are sintered on a surface of magnetic particles for electromagnetic wave absorption and are formed as a conductive layer, on at least a portion of the electronic component.
Dependencies are inferred from the claim text.