Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

An electronics package comprising:

• an electrical component having an active surface coupled to a first surface of a support substrate and a back surface opposite the active surface;
• an insulating structure disposed on the first surface of the support substrate and surrounding the electrical component, the insulating structure absent from a majority of an area between the electrical component and the support substrate and having at least one sloped side wall;
• an electromagnetic interference (EMI) shield encapsulating the back surface of the electrical component and the at least one sloped side wall of the insulating structure and covering at least a portion of the first surface of the support substrate surrounding the insulating structure;
• and
• an insulating material encapsulating the EMI shield.

A method of forming an electronics package comprising:

• bonding an active surface of an electronic component to a first surface of a support substrate;
• encapsulating at least the sidewalls of the electronic component with a resin material to form an insulating structure having a sloped sidewall, wherein the resin material is absent from a majority of an area between the electronic component and the support substrate;
• forming a conductive shield that encapsulates a back surface of the electronic component and the insulating structure;
• and
• forming a first wiring layer extending through at least one via in the support substrate to couple with the conductive shield.