Back to results
US 10,541,198 B2Granted
Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien Lin Chang Chien, Chin-Li Kao, Chang Chi Lee, Chih-Pin Hung
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.
Claims18
A method of manufacturing a semiconductor package, comprising:
- (a) providing a first carrier;
- (b) disposing a redistribution layer and a first electrical contact on the first carrier, wherein the first electrical contact is covered by the first carrier;
- (c) disposing a dielectric layer and a conductive pad on the redistribution layer, wherein the conductive pad is electrically connected to the redistribution layer, the dielectric layer has a second carrier thereon, and the second carrier has an opening to expose a portion of the conductive pad;
- and
- (d) forming a conductive layer within the opening to contact the portion of the conductive pad exposed from the second carrier.
2 more elements
Dependencies are inferred from the claim text.