QFN pre-molded leadframe having a solder wettable sidewall on each lead

A method comprising:

• placing a leadframe on a bottom mold tool, the leadframe having a first plurality of recesses and a plurality of apertures, each of the first plurality of recesses having a size and a shape configured to receive one of the plurality of ridges, the leadframe also having a plurality of die pads and a plurality of leads;
• placing a top mold tool on the leadframe, the top mold tool having a second plurality of recesses;
• forming a first plurality of molding compound portions in the plurality of apertures and forming a second plurality of molding compound portions in the second plurality of recesses in a single molding step to form a pre-molded leadframe;
• releasing the top mold tool and the bottom mold tool, the releasing including removing the pre-molded leadframe from the top mold tool and the bottom mold tool;
• coupling a plurality of dies to each respective die pad of the pre-molded leadframe;
• coupling the plurality of dies to the plurality of leads through a plurality of wires;
• encapsulating the plurality of dies, the plurality of wires, and the second plurality of molding compound portions with an encapsulant;
• and
• cutting the encapsulant, the leadframe and a metal layer to form a plurality of leadframe packages, each leadframe package having a first sidewall and a second sidewall with a portion of each sidewall covered by the metal layer.