Package structure of capacitive coupling isolator

A package structure for a capacitive coupling isolator, comprising:

• a first leadframe, including:
• a first signal input pin;
• a second signal input pin;
• and
• a first electrode plate including a first signal input positive electrode plate, a first signal input negative electrode plate, a second signal input positive electrode plate and a second signal input negative electrode plate separated from each other;
• a second leadframe corresponding to, aligning with and separated from the first leadframe, the second leadframe including:
• a first signal output pin;
• a second signal output pin;
• and
• a second electrode plate including a first signal output positive electrode plate, a first signal output negative electrode plate, a second signal output positive electrode plate and a second signal output negative electrode plate separated from each other;
• a transmitter disposed on the first leadframe and electrically connected to the first signal input pin, the second signal input pin and the first electrode plate;
• a receiver disposed on the second leadframe and electrically connected to the first signal output pin, the second signal output pin and the second electrode plate;
• a package body enclosing the first leadframe and the second leadframe, the package body being filled between the first leadframe and the second leadframe for electrically isolating the first leadframe and the second leadframe from each other;
• wherein the first electrode plate and the second electrode plate are arranged one above each other and aligned with each other for forming a plurality of capacitors.