Semiconductor package with interconnected leads
AssigneeTexas Instruments Incorporated
InventorsJeffrey Gail Holloway, Andy Quang Tran
Life of this patent
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Abstract
A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality of leads includes a top portion and a bottom portion. The top portion of each of the first plurality of leads is electrically connected to a contact pad of the plurality of contact pads. Each of a second plurality of leads includes a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion. The top portion of each of the second plurality of leads includes separate finger portions that are electrically connected to at least two of the plurality of contact pads.
Claims17
A semiconductor package comprising:
- a semiconductor die;
- a ceramic package body covering the semiconductor die, the ceramic package body including a plurality of contact pads;
- a first plurality of leads, each of the first plurality of leads including a top portion and a bottom portion, the top portion of each of the first plurality of leads electrically connected to a contact pad of the plurality of contact pads;
- and
- a second plurality of leads, each of the second plurality of leads including a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion, the top portion of each of the second plurality of leads including separate finger portions that are each electrically connected to a distinct one of the plurality of contact pads.
A ceramic semiconductor package comprising:
- a semiconductor die;
- a ceramic package body covering the semiconductor die, the ceramic package body including a plurality of contact pads;
- a plurality of leads, each of the plurality of leads including a top portion and a bottom portion, the top portion of each of the plurality of leads electrically connected to a respective one of the plurality of contact pads, the plurality of leads including a first lead and a second lead;
- and
- an interconnection portion wherein a top portion of the first lead and a top portion of the second lead extend from the interconnection portion and a bottom portion of the first lead and a bottom portion of the second lead extend from the interconnection portion.
Dependencies are inferred from the claim text.