Lead frame and method for manufacturing semiconductor device

A lead frame comprising:

• a first lead terminal including a first end connected to an outer frame and a second end that is wider than the first end;
• a second lead terminal provided parallel to the first lead terminal and including a third end connected to the outer frame and a fourth end that is wider than the third end;
• and
• a tie bar disposed between the first end and the second end along the first lead terminal and between the third end and the fourth end along the second lead terminal, and connecting the first lead terminal and the second lead terminal,
• wherein the tie bar comprises:
• a first narrow-width section touching the first lead terminal;
• a second narrow-width section touching the second lead terminal;
• a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section, and
• the wide-width section has a through-hole formed between the first narrow-width section and the second narrow-width section, and the through-hole is formed only in the wide-width section.