Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material

A computer, comprising:

• a plurality of processing cores coupled to a memory controller, the memory controller coupled to a system memory and a peripheral control hub, the computer further comprising:
• a first semiconductor die;
• a second semiconductor die stacked on the first semiconductor die, the first semiconductor die having a larger surface area than the second semiconductor die such that there exists a peripheral region of the first semiconductor die that is not covered by the second semiconductor die;
• thermally conductive material above the second semiconductor die;
• a compound mold laterally adjacent to but not over the second semiconductor die and between the thermally conductive material and the peripheral region of the first semiconductor die, the compound mold further laterally adjacent to the first semiconductor die, wherein the compound mold does not comprise a thermally conductive filler;
• and,
• a thermally conductive structure extending through the compound mold that thermally couples the peripheral region to the thermally conductive material.

An apparatus, comprising:

• a first semiconductor die;
• a second semiconductor die stacked on the first semiconductor die, the first semiconductor die having a larger surface area than the second semiconductor die such that there exists a peripheral region of the first semiconductor die that is not covered by the second semiconductor die;
• thermally conductive material above the second semiconductor die;
• a compound mold between the thermally conductive material and both the second semiconductor die and the peripheral region of the first semiconductor die;
• and,
• a thermally conductive structure extending through the compound mold that thermally couples the peripheral region to the thermally conductive material, wherein the thermally conductive structure is formed from thermally conductive paste.

A computer, comprising:

• a plurality of processing cores coupled to a memory controller, the memory controller coupled to a system memory and a peripheral control hub, the computer further comprising:
• a first semiconductor die;
• a second semiconductor die stacked on the first semiconductor die, the first semiconductor die having a larger surface area than the second semiconductor die such that there exists a peripheral region of the first semiconductor die that is not covered by the second semiconductor die;
• thermally conductive material above the second semiconductor die, wherein the thermally conductive structure is formed from solder paste;
• a compound mold laterally adjacent to but not over the second semiconductor die and between the thermally conductive material and the peripheral region of the first semiconductor die, the compound mold further laterally adjacent to the first semiconductor die;
• and,
• a thermally conductive structure extending through the compound mold that thermally couples the peripheral region to the thermally conductive material.