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US 10,541,188 B2Granted
Power module and manufacturing method thereof
AssigneesHyundai Motor Company, Kia Motors Corporation
InventorMichiaki Hiyoshi
Life of this patent
Estimating the term…
Abstract
A power module includes: a substrate; a power conversion chip disposed on one surface of the substrate; and a radiation member bonded to another surface of the substrate. The radiation member has a contact surface configured to come into contact with the other surface of the substrate, and includes a fused area within the contact surface so as to be fused to the other surface of the substrate.
Claims4
A power module comprising:
- a substrate;
- a power conversion chip disposed on one surface of the substrate;
- and
- a radiation member bonded to another surface of the substrate,
- wherein the radiation member has a contact surface configured to come into contact with the other surface of the substrate, and includes a fused area within the contact surface so as to be fused to the other surface of the substrate, and
- wherein the fused area has a mesh pattern.
3 more elements
Dependencies are inferred from the claim text.