Semiconductor package including organic interposer
AssigneeSamsung Electronics Co., Ltd.
InventorsJun Woo Myung, Akihisa Kuroyanagi, Yeong A Kim, Eun Sil Kim
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Abstract
A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.
Claims18
A semiconductor package, comprising:
- a first semiconductor chip and a second semiconductor chip each having active surfaces on which connection pads are disposed;
- an organic interposer disposed on the active surfaces of the first semiconductor chip and the second semiconductor chip and including a wiring layer electrically connected to the connection pads;
- an underfill resin disposed between the first semiconductor chip and the organic interposer and between the second semiconductor chip and the organic interposer;
- barrier layers disposed on outer side surfaces of the first semiconductor chip and the second semiconductor chip, the barrier layers comprising a first barrier layer disposed between a side surface of the first semiconductor chip and a side surface of the second semiconductor chip;
- and
- an encapsulant encapsulating at least portions of the first semiconductor chip and the second semiconductor chip.
A semiconductor package, comprising:
- a semiconductor chip having an active surface on which connection pads are disposed thereon;
- an organic interposer disposed on the active surface of the semiconductor chip and including a wiring layer electrically connected to the connection pads;
- an underfill resin disposed between the semiconductor chip and the organic interposer;
- an encapsulant encapsulating at least portions of the semiconductor chip;
- and
- a barrier layer disposed between the semiconductor chip and the encapsulant, the barrier layer being disposed between an outer side surface of semiconductor chip and an outer side surface of an adjacent semiconductor chip.
Dependencies are inferred from the claim text.