Electronics package with integrated interconnect structure and method of manufacturing thereof

A method of manufacturing an electronics package comprising:

• coupling a back surface of an electrical component to a first surface of an insulating substrate;
• wherein the insulating substrate comprises a first surface and a second surface opposite the first surface;
• wherein the electrical component comprises:
• an active surface opposite the back surface;
• at least one contact pad on the active surface;
• and
• a plurality of side walls extending between the active surface and the back surface
• forming an insulating structure encapsulating at least a portion of a perimeter of the electrical component formed by the plurality of side walls, the insulating structure absent from a majority of an area between the electrical component and the insulating substrate and comprising a sloped side surface;
• forming a first wiring layer on a portion of the first surface of the insulating substrate and along the sloped side surface of the insulating structure to electrically couple with the at least one contact pad;
• and
• electrically coupling the first wiring layer to a second wiring layer disposed on the second surface of the insulating substrate through at least one via formed through the insulating substrate.

An electronics package comprising:

• an electrical component having a back surface coupled to a first surface of an insulating substrate, an active surface facing away from the insulating substrate, and a plurality of side walls extending between the active surface and the back surface, the active surface having at least one of imaging and optical functionality;
• an insulating structure encapsulating a perimeter of the electrical component formed by the plurality of side walls and covering a portion of the active surface thereof, wherein the insulating structure is absent from a majority of an area between the electrical component and the insulating substrate;
• a first wiring layer formed on a sloped side wall of the insulating structure and electrically coupled to at least one contact pad on the active surface of the electrical component;
• and
• a second wiring layer formed on a second surface of the insulating substrate opposite the first surface and electrically coupled to the first wiring layer through at least one via formed in the insulating substrate.