Transient liquid phase material bonding and sealing structures and methods of forming same
AssigneeSkyworks Solutions, Inc.
InventorBradley Paul Barber
Life of this patent
Estimating the term…
Abstract
A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.
Claims19
A bonding element comprising:
- a first transient liquid phase structure including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first transient liquid phase structure having a first value, the first transient liquid phase structure being disposed on a substrate and having a closed geometric shape surrounding a portion of the substrate upon which no transient liquid phase structure is disposed;
- and
- a second transient liquid phase structure including the first material and the second material, a ratio of a quantity of the first material and the second material in the second transient liquid phase structure having a second value different from the first value, the second transient liquid phase structure being disposed on the substrate and having a closed geometric shape surrounding the first transient liquid phase structure, the second transient liquid phase structure being at least partially separated from the first transient liquid phase structure by a second portion of the substrate upon which no transient liquid phase structure is disposed.
A bonding element comprising:
- a first bonded structure including a first alloy of a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first bonded structure having a first value, the first bonded structure being disposed on a substrate and having a closed geometric shape surrounding a portion of the substrate upon which no bonded structure is disposed;
- and
- a second bonded structure including a second alloy of the first material and the second material, a ratio of a quantity of the first material and the second material in the second bonded structure having a second value different from the first value, the second bonded structure being disposed on the substrate and having a closed geometric shape surrounding the first bonded structure, the second bonded structure being at least partially separated from the first bonded structure by a second portion of the substrate upon which no bonded structure is disposed.
A bonding element comprising:
- a first transient liquid phase structure including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first transient liquid phase structure having a first value, the first transient liquid phase structure being disposed on a substrate and surrounding a device disposed on the substrate;
- a second transient liquid phase structure including the first material and the second material, a ratio of a quantity of the first material and the second material in the second transient liquid phase structure having a second value different from the first value, the second transient liquid phase structure being surrounding the first transient liquid phase structure;
- and
- at least one transient liquid phase strut connecting the first transient liquid phase structure and the second transient liquid phase structure.
Dependencies are inferred from the claim text.