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US 10,541,149 B2Granted
Gettering layer forming method
AssigneeDisco Corporation
InventorSeiji Harada
Life of this patent
Estimating the term…
Abstract
A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer.
Claims3
A gettering layer forming method for forming a gettering layer on a back side of a wafer having devices formed on a front side, the gettering layer forming method comprising:
- a coating step of dropping a solution of metal salt from a nozzle onto the back side of the wafer while rotating the wafer;
- and
- a drying step of drying the wafer after performing the coating step, thereby forming the gettering layer containing the metal salt on the back side of the wafer;
- wherein the gettering layer is not removed from the back side of the wafer after the drying step, and is provided on the back side of each of the devices to prevent reduction of die strength of each device.
1 more element
Dependencies are inferred from the claim text.