Multilayer ceramic electronic component including an organic layer

A multilayer ceramic electronic component comprising:

• a laminated body including a plurality of laminated dielectric layers and a plurality of laminated internal electrodes, the laminated body including a first principal surface and a second principal surface opposite in a laminating direction, a first side surface and a second side surface opposite in a width direction perpendicular or substantially perpendicular to the laminating direction, and a first end surface and a second end surface opposite in a length direction perpendicular or substantially perpendicular to the laminating direction and the width direction;
• a first external electrode electrically connected to the internal electrodes, and located on the first end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface;
• a second external electrode electrically connected to the internal electrodes, and located on the second end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface;
• wherein
• the first external electrode includes a first base electrode layer including a conductive metal and a glass component, a first organic layer including an organic silicon compound, covering the first base electrode layer, and a first plating layer located on the first organic layer;
• the second external electrode includes a second base electrode layer including a conductive metal and a glass component, a second organic layer including an organic silicon compound, covering the second base electrode layer, and a second plating layer located on the second organic layer;
• the first organic layer covers from the first base electrode layer to at least a portion of a surface of the laminated body, and the second organic layer covers from the second base electrode layer to at least a portion of a surface of the laminated body;
• a leading end of the first plating layer extends beyond an end of the first base electrode in the length direction and is in contact with the first organic layer, with the first organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the first base electrode layer;
• a leading end of the second plating layer extends beyond an end of the second base electrode in the length direction and is in contact with the second organic layer, with the second organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the second base electrode layer;
• and
• an atomic concentration of Si to Cu is about 1% or more and about 5% or less between a Cu concentration and an Si concentration at surfaces of the first organic layer and of the second organic layer.