Coil unit for power inductor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMoon Seok Heo, Chang Ho Lee, Young Woong Song
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Abstract
The present invention relates to a coil unit for a power inductor, a manufacturing method of a coil unit for a power inductor, a power inductor and a manufacturing method of a power inductor. The coil unit includes an insulating substrate and a coil pattern, wherein the coil pattern has a first plating part formed at least one surface among top and bottom surfaces of the insulating substrate, wherein a top side thereof has the shape of a taper and a second plating part formed to encompass the first plating part and to correspond to a shape of the first plating part.
Claims11
A coil unit for a power inductor, comprising:
- an insulating substrate;
- and
- a coil pattern, comprising:
- a first plating part, formed on one of a top surface and a bottom surface of the insulating substrate, arranged at a middle portion of the coil pattern, and tapered at a top side thereof so as to become narrower toward the top side thereof;
- and
- a second plating part, formed to envelop a side surface and a top surface of the first plating part, and tapered at a top side thereof to correspond to the tapered top side of the first plating part,
- wherein the first plating part comprises a seed layer, and a width of the seed layer and a width of an abutting surface of the first plating part are substantially the same, and
- wherein the second plating part covers the side surface of the first plating part and a side surface of the seed layer.
A coil unit for a power inductor, comprising:
- an insulating substrate;
- and
- a coil pattern, comprising:
- a first plating part, formed on one of a top surface and a bottom surface of the insulating substrate, arranged at a middle portion of the coil pattern, and tapered at a top side thereof so as to become narrower toward the top side thereof;
- and
- a second plating part, formed to envelop a side surface and a top surface of the first plating part, and tapered at a top side thereof to correspond to the tapered top side of the first plating part,
- wherein the first plating part comprises a seed layer, and a height of the seed layer and a height of the first plating part are substantially different, and
- wherein the second plating part covers the side surface of the first plating part and a side surface of the seed layer.
Dependencies are inferred from the claim text.