Chip resistor and paste for forming resist layer of chip resistor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJang-Seok Yun
Life of this patent
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Abstract
A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.
Drawings
Claims15
A paste for forming a resist layer of a resistor, comprising:
- a copper-based alloy powder;
- and
- a nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder,
- wherein the paste is glass-free.
A chip resistor, comprising:
- a substrate;
- a first electrode disposed on a surface of the substrate;
- a second electrode disposed on the surface of the substrate such that the second electrode is separated from the first electrode;
- a resist layer disposed on the surface of the substrate so as to connect the first electrode and the second electrode to each other;
- and
- a protective layer disposed on a surface of the resist layer so as to protect the resist layer,
- wherein the resist layer comprises a copper-based alloy, and nickel (Ni) in an amount greater than 0 wt % of the copper-based alloy and less than or equal to 10 wt % of the copper-based alloy, and
- wherein the resist layer is glass-free.
A chip resistor, comprising:
- a substrate;
- a first electrode disposed on a surface of the substrate;
- a second electrode disposed on the surface of the substrate such that the second electrode is separated from the first electrode;
- upper surface electrodes respectively disposed directly on the first electrode and the second electrode;
- a resist layer disposed on the surface of the substrate so as to connect the first electrode and the second electrode to each other;
- and
- a protective layer disposed on a surface of the resist layer so as to protect the resist layer,
- wherein the resist layer comprises a copper-based alloy and nickel (Ni), and
- wherein the resist layer is glass-free.
A chip resistor, comprising:
- a substrate;
- a first electrode disposed on a surface of the substrate;
- a second electrode disposed on the surface of the substrate such that the second electrode is separated from the first electrode;
- upper surface electrodes respectively disposed on the first electrode and the second electrode;
- a resist layer disposed on the surface of the substrate so as to connect the first electrode and the second electrode to each other;
- and
- a protective layer disposed on a surface of the resist layer so as to protect the resist layer,
- wherein the upper surface electrodes each comprise
- an interpose part interposed between the first electrode or the second electrode and the resist layer, and
- an extension part extended from the interpose part to a portion of the surface of the resist layer,
- wherein the resist layer comprises a copper-based alloy and nickel (Ni), and
- wherein the resist layer is glass-free.
Dependencies are inferred from the claim text.