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US 10,541,065 B2Granted
Multilayer stack with enhanced conductivity and stability
AssigneeThe Boeing Company
InventorsPatrick John Kinlen, Matthew Flack, Eric Alan Bruton
Life of this patent
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Abstract
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Claims20
A method comprising:
- depositing an insulating layer on a substrate;
- forming a conductive polymer layer on the insulating layer;
- and
- repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers, wherein each respective conductive polymer layer has a respective electrical resistance, and wherein the respective conductive polymer layers are electrically connected in parallel, such that a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance, and wherein repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form the multilayer stack comprises forming the multilayer stack to modify electrical resistivity over the substrate, such that a first location over the multilayer stack has an electrical resistivity that is different from a respective electrical resistivity at a second location over the multilayer stack, wherein forming the multilayer stack to modify the electrical resistivity over the substrate comprises:
- (i) depositing a number of conductive polymer layers at the first location that is different from a respective number of conductive polymer layers at the second location in a longitudinal direction over the substrate, (ii) depositing conductive polymer layers having a type of conductive polymer at the first location that is different from a respective type of conductive polymer at the second location, or (iii) depositing conductive polymer layers having a thickness at the first location that is different from a respective thickness of conductive polymer layers at the second location.
2 more elements
A device comprising:
- a substrate;
- and
- a multilayer stack disposed on the substrate, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein each conductive polymer layer has a respective electrical resistance, wherein the plurality of conductive polymer layers are electrically connected in parallel, and wherein a number of conductive polymer layers of the plurality of conductive polymer layers at a first location over the substrate is different from a respective number of conductive polymer layers of the plurality of conductive polymer layers at a second location in a longitudinal direction over the substrate, such that an electrical resistivity at the first location over the multilayer stack is different from a respective electrical resistivity at the second location over the multilayer stack.
A component of an aircraft, the component comprising:
- a multilayer stack disposed on or proximate to a surface of the component, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein each conductive polymer layer has a respective electrical resistance, wherein the plurality of conductive polymer layers are electrically connected in parallel to a power source, such that a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance, and wherein a number of the conductive polymer layers of the multilayer stack at a first location of the component is different from a number of the conductive polymer layers of the multilayer stack at a second location in a longitudinal direction over the component so as to generate a different amount of heat at the first location over the multilayer stack compared to the second location over the multilayer stack.
Dependencies are inferred from the claim text.