Memory device with configurable input/output interface

An apparatus, comprising:

• an array of memory cells;
• a first conductive path coupled with the array of memory cells;
• a second conductive path coupled with the array of memory cells;
• an interface configurable between a first configuration and a second configuration;
• and
• a controller coupled with the interface, the controller operable to:
• couple the first conductive path with the second conductive path based at least in part on a type of a substrate associated with the array of memory cells, the substrate configured to couple a memory device with a host device;
• and
• select a modulation scheme for signals communicated between the memory device and the host device using the first conductive path or the second conductive path based at least in part on coupling the first conductive path with the second conductive path.

A method, comprising:

• activating a first switching component to couple a first conductive path of a memory device with a memory die based at least in part on a type of a substrate that is configured to couple the memory device with a host device;
• activating a second switching component to couple a second conductive path of the memory device with the memory die based at least in part on the type of the substrate, wherein the first conductive path is coupled with the second conductive path based at least in part on activating the first switching component and activating the second switching component, wherein a first driver and a first receiver in electronic communication with the first conductive path are coupled with a second driver and a second receiver in electronic communication with the second conductive path based at least in part on activating the first switching component and activating the second switching component;
• and
• selecting a modulation scheme for signals communicated between the memory device and the host device using the first conductive path and the second conductive path based at least in part on activating the first switching component and activating the second switching component.

A method, comprising:

• coupling a first conductive path of a memory device with a second conductive path of the memory device based at least in part on a type of a substrate that is configured to couple the memory device with a host device;
• selecting a modulation scheme for signals communicated between the memory device and the host device based at least in part on coupling the first conductive path with the second conductive path;
• and
• modifying a drive strength of at least two drivers coupled with the first conductive path and the second conductive path based at least in part on coupling the first conductive path with the second conductive path.