System for manufacturing a semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng
Life of this patent
Estimating the term…
Abstract
A system including a memory; and a simulation tool connected to the memory. The simulation tool is configured to receive information related to a plurality of dies. The simulation tool is further configured to receive a plurality of input vectors. The simulation tool is further configured to determining a temperature profile for a first die of the plurality of dies. The simulation tool is further configured to simulate operation of a second die of the plurality of dies based on the determined temperature profile and the received plurality of input vectors.
Claims20
A system comprising:
- a memory;
- and
- a simulation tool connected to the memory, wherein the simulation tool is configured to:
- receive information related to a plurality of dies,
- receive a plurality of input vectors,
- determine a temperature profile for a first die of the plurality of dies, and
- simulate operation of a second die of the plurality of dies based on the determined temperature profile and the received plurality of input vectors.
A system comprising:
- a memory configured to store a plurality of temperature functions;
- and
- a simulation tool connected to the memory, wherein the simulation tool is configured to:
- receive information related to a plurality of dies,
- receive a plurality of input vectors,
- determine a temperature profile for a first die of the plurality of dies, and
- simulate operation of a second die of the plurality of dies based on the determined temperature profile, the received plurality of input vectors and at least one temperature function of the plurality of temperature functions.
A system comprising:
- a memory;
- and
- a simulation tool connected to the memory, wherein the simulation tool is configured to:
- receive information related to a plurality of dies,
- receive a plurality of input vectors,
- determine a temperature profile for a first die of the plurality of dies,
- divide the temperature profile of the first die into a plurality of grids,
- vary a grid size of the plurality of grids,
- simulate operation of a second die of the plurality of dies based on the determined temperature profile for a first grid size of the plurality of grids and the received plurality of input vectors, and
- simulate operation of a second die of the plurality of dies based on the determined temperature profile for a second grid size of the plurality of grids and the received plurality of input vectors.
Dependencies are inferred from the claim text.