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US 10,539,982 B2Granted
Housing assembly and cover applied to electronic device
AssigneeASUSTeK COMPUTER INC.
InventorsChih-Kuang Lin, Szu-Tang Chiu, Wai-Tong Chan, Sin-Fei Lai
Life of this patent
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Abstract
The present disclosure provides a housing assembly, and the housing assembly is applied to an electronic device. The housing assembly includes a first part and a second part. The first part includes at least one opening. The second part includes at least one mesh area. The mesh area deformably connects to the first part, and covers the opening.
Claims9
A housing assembly, applied to an electronic device, and the housing assembly comprising:
- a first part, including an opening;
- and
- a second part, including a mesh area deformably connecting to the first part and covering the opening,
- wherein the mesh area is configured to be selectively deformed to form an air inlet area, and
- wherein the second part is sleeved on the first part.
2 more elements
A cover, applied to an electronic device, the electronic device including a housing with an opening, and the cover comprising:
- a mesh area, deformably connecting to the housing, and covering the opening,
- wherein the mesh area is configured to be selectively deformed to form an air inlet area, and
- wherein the cover is configured to be sleeved on the housing.
Dependencies are inferred from the claim text.