Fiber attach assembly and test automation
AssigneeInternational Business Machines Corporation
InventorsPaul F. Fortier, Barnim Alexander Janta-Polczynski, Stephan L. Martel, Dany Minier
Life of this patent
Estimating the term…
Abstract
An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.
Claims13
A method for assembling a photonic chip with integrated optical fibers, the method comprising:
- providing an assembly station for assembling the photonic chip;
- providing a die;
- providing one or more optical fibers;
- placing the one or more optical fibers into corresponding one or more grooves of the die by one or more position guiders comprising one or more tubular collet chucks operatively connected to one or more stages comprising one or more actuators for moving the one or more tubular collet chucks;
- bonding the one or more optical fibers to the die;
- performing an optical test of the die using the one or more optical fibers;
- and
- severing the one or more optical fibers.
Dependencies are inferred from the claim text.