Methods for acquiring planar view STEM images of device structures

A method for preparing a sample, the method comprising:

• placing a wafer on a movable stage of a dual beam system;
• milling an initial lamella within the wafer using a focused ion beam of the dual beam system;
• lifting the initial lamella with a micromanipulator of the dual beam system;
• placing the initial lamella on an upper surface of the wafer with the micromanipulator;
• and
• milling a planar lamella to include at least a portion of the initial lamella with the focused ion beam of the dual beam system.

A method of preparing a sample, the method comprising:

• placing a first lamella on an upper surface of a wafer;
• milling a window in an upper portion of the first lamella to expose at least one internal structure of the first lamella;
• based at least partially on the exposed at least one internal structure of the first lamella, aligning the first lamella on the upper surface of the wafer;
• and
• milling a second lamella out of a portion of the first lamella and the wafer to include at least substantially an entire length of the at least one internal structure of the first lamella.